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Nu-Maber Italy Advances Flexographic Platemaking with Dual ThermoFlexX Catena-E 80 Units and Industry 4.0 Certification

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Nu-Maber Italy Advances Flexographic Platemaking with Dual ThermoFlexX Catena-E 80 Units and Industry 4.0 Certification

 Nu-Maber, a leading flexographic plate producer in Italy, has significantly enhanced its production capabilities by installing two ThermoFlexX Catena-E 80 exposure units from XSYS. This investment underlines Nu-Maber’s dedication to precision, efficiency, and sustainable practices while reinforcing its commitment to digital transformation, certified under the rigorous Industry 4.0 guidelines by Polo Technologic Alto Adriatic Andrea Galvani.

 Located in Treviso, Nu-Maber has a longstanding reputation for excellence in the flexographic printing industry. This latest step in their growth journey is centered around the ThermoFlexX Catena-E 80 exposure units, state-of-the-art technology that ensures consistent high-quality plate production. With a maximum plate size of 1270 x 2032 mm (50 x 80”) and advanced LED technology for both main and back exposures, these units provide precision imaging and robust performance, ensuring superior results for flexographic printing applications.

ProServX: Enabling Industry 4.0 Connectivity

 Incorporating XSYS’s ProServX software, the new equipment ensures seamless integration with Nu-Maber’s digital infrastructure. ProServX supports Industry 4.0 compliance with features such as real-time monitoring, predictive maintenance, and remote diagnostics. Importantly, customers like Nu-Maber can leverage the system’s REST API to connect directly with their MIS (Management Information Systems) or ERP (Enterprise Resource Planning) systems. This integration streamlines data flow, enhances productivity, and ensures that all operations are digitally interconnected.

The independent certification provided by Polo Tecnologico Alto Adriatico Andrea Galvani affirms that ProServX fully meets Industry 4.0 requirements. According to the certification report, the system ensures:

  • Real-time Data Exchange: Through TCP/IP-based REST APIs, ProServX facilitates bidirectional communication with internal and external MIS and ERP systems.. Furthermore, ProServX allows continuous monitoring of the equipment through machine dashboards and e-mail reporting. This includes production data, consumable usage and also machine internal parameters and measurements to make sure every plate is perfectly processed.
  • Remote Maintenance and Diagnostics: Enabled via secure connections, the equipment can be updated, performance monitored, and  potential issues can be addressed without interrupting operations.
  • Automated Integration: The system supports seamless automation by connecting directly to factory logistics systems, creating a cohesive production environment.
  • Simple & intuitive human-machine interfaces: Via the easy-to-use interface on the large touch-screen operators can effortlessly manipulate the equipment. Additionally, all the HMI look and operate the same over the whole TFxX/Catena range, making it easy for the operators to manage multiple machines.
  • Compliance to the latest occupational safety, health and hygiene parameters: Because operators safety is a major design perspective at XSYS, all the equipment meets the requirements of the European Machinery Directive and have CE certificates.

“The independent certification highlights the transformative power of ProServX in modern production settings,” said Roberto Malagu, Sales Manager XSYS Italy. “Nu-Maber’s implementation exemplifies how companies can optimize their processes while meeting the most stringent digital transformation standards.”

A Continued Partnership in Quality

 Nu-Maber has been a dedicated user of XSYS’s nyloflex ACT Digital and FAH Digital plates, renowned for their high durability and excellent ink transfer properties. These plates perfectly complement the advanced capabilities of the Catena-E 80 systems, empowering Nu-Maber to produce exceptional flexographic printing plates with unmatched precision, ensuring consistent, high-quality print results across every project.

By integrating the Catena-E 80 units and ProServX into their workflow, Nu-Maber demonstrates their commitment to innovation, ensuring precision in platemaking while reducing operational costs and environmental impact.

 Future-Proof Technology

The modular design of the ThermoFlexX Catena-E 80 offers scalability for future advancements, including full automation of the platemaking process. With this investment, Nu-Maber is not only addressing present needs but also positioning itself as a leader in the evolving flexographic printing landscape.

“We are proud to partner with Nu-Maber in their journey towards digital excellence,” stated Roberto.  “This project reflects our shared vision for combining quality, sustainability, and innovation to drive the industry forward.”

https://xsysglobal.com/

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MicroFight -Anti-microbial Solution for the Modern World

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MicroFight -Anti-microbial Solution for the Modern World

The COVID-19 pandemic has dramatically heightened global awareness of the pervasive threat of microbial contamination. As industries grappled with the challenges posed by harmful microbes, the demand for innovative anti-microbial solutions surged. Microbes are tiny organisms, including bacteria, fungi, viruses, and algae, that are present virtually everywhere. While some microbes play beneficial roles (e.g., in digestion or nutrient cycling), others are harmful. Understanding and controlling the detrimental ones is essential for safeguarding public health and ensuring product safety across various sectors. From healthcare facilities to food processing plants, the presence of unfriendly bacteria and other microorganisms can lead to serious consequences.

Pathogenic microbes, especially bacteria and fungi, feed on materials like plastics and polymers, leading to structural degradation, odour generation, and staining. It is hazardous to the durability and functionality of products.

By developing effective anti-microbial technologies, it is possible to mitigate these risks and create a safer, healthier world. NICHEM Solutions, one of the leaders in innovative anti-microbial technologies, has pioneered the Microsoft technology, including its key product, Micro Fight 014.

Harmful microbes can lead to serious health risks, especially in environments where hygiene is critical. Areas such as hospitals, food processing plants, water purification systems, and pharmaceutical industries need microbe-free air and surfaces to avoid infection and contamination.

MicroFight is versatile and finds applications across numerous sectors:

  • Bottles, films, and containers
  • Water purification units
  • Water storage tanks
  • Kitchen and bathroom appliances
  • Shower curtains, bathmats, and toilet seats
  • Packaging plastics

Anti-microbial technology uses agents or substances that inhibit the growth of or kill harmful microbes. By adding antimicrobial actives during manufacturing integration anti-microbial additives into materials, products are protected from microbial growth on surfaces. It leads to prolonging their lifespan and improving hygiene. Common anti-microbial agents include Silver, Copper, Triclosan, Mercury, Lead, etc and organic compounds, each with distinct properties. Among these agents, Silvers the most ancient and potent antimicrobial in use.

MicroFight by NICHEM

NICHEM Solutions is a leader in antimicrobial technology, specialising in Silver and Copper-based solutions. Their MicroFight range (MF 002, MF 003, MF 006, MF 012, MF 014, MF 017) offers innovative antimicrobial protection. These additives, combining organic and inorganic actives, including Silver and Copper, provide protection for desired periods.

MicroFight is designed for high efficacy, easy integration into polymers, and safety. These qualities make it ideal for various applications, such as food packaging, healthcare, consumer goods, and water purification. MicroFight’s exceptional antimicrobial properties are based on supported Silver and operate through Redox Potential Action.

Unlike traditional anti-microbial agents, MicroFight is non-toxic, eco-friendly, and free of heavy metals, making it a sustainable option for industries focused on safety and environmental protection. It is under US-EPA Registration which positions it as a strong contender in the international market, especially in the U.S., where stringent environmental standards apply.

How MicroFight is different from others

  • Effective microbial restriction: Controls the growth of bacteria and fungi on surfaces.
  • Pathogen-targeted protection: Primarily effective against gram-negative bacteria, which are common pathogens.
  • Residual Protection: Ensures long-lasting efficacy after application.
  • Material compatibility: Does not alter the properties of polymers, ensuring the product’s durability.
  • Low-concentration efficacy: Functions effectively at minimal concentrations, making it cost-efficient.
  • Non-toxic and eco-friendly: Free of harmful heavy metals, making it safe for consumers and the environment.

Anti-microbials are essential for industries seeking to improve product hygiene and lifespan. NICHEM’s MicroFight is an innovative technology offering long-term protection against harmful microbes. In this recognition, NICHEM received the Atmanirbhar Bharat Award in 2021. Developed during the COVID-19 pandemic, it provides industries with a reliable and sustainable solution to prevent microbial contamination. With EPA approval pending, MicroFight is set to impact the global market.

NICHEM is working on various anti-microbials at its Innovation Centre. The centre focuses on encouraging a culture of innovation, supporting internal R&D, and offering R&D services to other organisations in the industry. This facility made it possible to create the product even during the pandemic, ensuring timely solutions for industrial needs.

https://nichem.solutions

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Mondi Hosts Manufacturing Industry Leaders At Modernized Mondi Warsaw Plant

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Mondi Hosts Manufacturing Industry Leaders At Modernized Mondi Warsaw Plant

Mondi hosts manufacturing leaders at the modernized Mondi Warsaw plant.
  • Around 200 representatives of leading manufacturers from all over Poland took part in discussions on the future of packaging during the opening of Mondi Warsaw
  • Discussions focused on how sustainability impacts decision-making, co-creating packaging solutions, and trends such as packaging automation.
  • Mondi recently completed a 90 million investment in its Mondi Warsaw corrugated packaging plant in Mszczonów, doubling its production capacity.

Mondi, a global leader in sustainable packaging and paper, recently invited leading Polish manufacturing companies to its modernized facility in Mszczonów, near Warsaw,  to exchange views on innovations, trends and circular solutions in the packaging industry.

Mondi Warsaw’s Mszczonów plant recently completed a €90 million modernization that doubled its production capacity, making it the largest corrugated packaging plant in Poland and one of the largest in Europe. The investment enables the plant to better support customers by delivering innovative and sustainable packaging solutions.

Mondi hosts manufacturing leaders at the modernized Mondi Warsaw plant.

The event was full of attractions, including product zones, where participants could see the latest packaging solutions from Mondi Warsaw. The closed-loop zone, presenting Mondi’s circular economy initiative, implemented in cooperation with the Biedronka chain – the largest retail chain in Poland, enjoyed particular interest.

“Today’s event is particularly important because it highlights the key role of corrugated packaging. In the retail sector, it is used not only for transport and display, but also as a foundation for our sustainability efforts. Much of today’s discussion focused on closing the loop, understanding the function of packaging and prioritizing sustainability – an area where corrugated packaging excels,” said Katarzyna Grabarska from Jeronimo Martins Polska, owner of the Biedronka chain.

The event also showcased Mondi’s newest workshop space, ThinkBox Świecie, the company’s fourth facility dedicated to co-creating optimized packaging solutions with customers. This space is proof of Mondi’s commitment to innovation and collaboration in developing effective, sustainable packaging.

Mondi hosts manufacturing leaders at the modernized Mondi Warsaw plant.

A virtual tour of the facility provided attendees with a glimpse of the modernised infrastructure, demonstrating the scale of the investment and its role in driving future growth and innovation.

Wojciech Ławniczak, CEO of VHS Services and speaker at the event, presented four key pillars for shaping the future: “Investing in the future is about understanding and using the concept of artificial intelligence. Collecting and analyzing data is key – about customers, the market and internal processes. The third important element is a clear strategy. However, the fourth element is the most important – promoting cooperation both inside and outside the organization.”

The customer event in Warsaw confirmed Mondi’s commitment to sustainable development, building strong partnerships and delivering tailored packaging solutions.

www.mondigroup.com

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Car Users’ Concerns to Define Interior of Fully Autonomous Cars, Citing 5th Global Automotive Consumer Survey by Asahi Kasei

Car Users’ Concerns to Define Interior of Fully Autonomous Cars, Citing 5th Global Automotive Consumer Survey by Asahi Kasei

Fully autonomous cars will become mobile living rooms, allowing car manufacturers to reimagine the future of car interiors. In its fifth annual survey, the Japanese technology company Asahi Kasei asked car users in the four major automotive markets about their expectations and concerns regarding fully autonomous vehicles and their perception of sustainability. Customer preferences for interior design, features, and usage scenarios offer the automotive industry valuable hints about what the car of the future should look like.

The results of Asahi Kasei’s fifth global Automotive Consumer Survey present meaningful information about what customers in the four major automotive markets (Japan, China, Germany, and the United States) expect from autonomous vehicles and how they would spend their time in one.

Distrust in technology

Car users are still conservative regarding the operation of a fully autonomous car; a retractable steering wheel and pedals are not considered valuable to most respondents. This confirms the results of the last survey from 2022, which found that even in fully autonomous vehicles, a large proportion of users in Germany, the USA, and China prefer to have a steering wheel and brake pedal for optional manual control. In Japan, one in two share this outlook. In Germany and the USA, providing a manual control option could help increase acceptance of fully autonomous cars.

In addition, two out of three car users in Germany, the USA, and China stated they would still observe traffic while in autonomous mode—activities while in the car, such as watching movies or playing games, are at the bottom of the list (see Figure 1). This is another indication that car users today have safety and trust concerns about fully autonomous cars. These sentiments will profoundly define the interior design of the first generations of fully autonomous vehicles.

Silent cabin for communication and listening to music

When asked about the most valued interior aspect of an autonomous car, one out of two respondents mentioned “silent cabin” (see Figure 2). This speaks to the woes of many battery electric vehicle (BEV) users; almost every fourth user of a BEV mentioned “too much noise while driving” as the most annoying aspect of the driving experience. While the BEV itself is quieter than a car with an internal combustion engine (ICE), the noise of wind, tires, gears, and motors—sounds that are typically suppressed by the engine noise—becomes more prevalent. In fully autonomous electric vehicles, and with the ability to engage with other activities while commuting, silence will even become more important for customers.

Looking at activities while riding in an autonomous vehicle, listening to music and podcasts is the primary activity of car users worldwide while driving, with 66% in the USA, 61% each in China and Japan, and 56% in Germany. Talking with other passengers is equally high in ranking, with sleeping or working as less important, highlighting the need for tables or lie-flat seats.

Perception of sustainability differs among regions

Car users no longer define a “sustainable vehicle” only by its drivetrain technology but also by its carbon footprint in production, easily recyclable materials, and overall sustainable production along the entire value chain. Buyers’ understanding of sustainability is growing, and the relevance of this topic in the purchasing process has increased in recent years.

Respondents in the Western markets define a sustainable car by its use of recyclable materials and sustainable production along the value chain. Meanwhile, for car users in China and Japan, the drivetrain technology primarily defines a sustainable car (see Figure 3). This topic is becoming more relevant for the purchase decision process, particularly in Western countries, with 35% of all respondents in Germany and the USA indicating they would switch their car brand to a more sustainable manufacturer to support greener mobility.

https://www.asahi-kasei.com/.

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ENVALIOR HONORED AS HITACHI ASTEMO’S LEADING GLOBAL MECHANICAL SUPPLIER

ENVALIOR HONORED AS HITACHI ASTEMO’S LEADING GLOBAL MECHANICAL SUPPLIER

  • Envalior wins Hitachi Astemo’s Global Supplier of the Year award for outstanding quality and service.
  • Envalior supplied key raw materials to Hitachi Astemo North America, including Akulon PA6 in 2023.
  • This award showcases Envalior’s dedication to innovation and strengthening partnerships in the global mobility sector.

    Air intake manifolds (AIM) are currently in production for Honda, all produced with Akulon K227-XHG6. Envalior North America will supply Akulon K227-XHG6 to Astemo for AIM applications in 2024. Pictured left to right: Eric Sheppard, Global Key Account Manager; Lisa Noyes, Customer Service Representative; Scott Hurt, Quality Control Supervisor; and, Keith Kauffmann, Application Development Engineer.

Envalior is honored to be named Global Supplier of the Year in the mechanical category by Hitachi Astemo, Ltd, Tokyo. This prestigious award was presented during Hitachi Astemo’s Global Partner Day 2024, held at their headquarters in Tokyo, Japan.

Selected from 18 exceptional nominees, Envalior earned this distinction for its outstanding customer service, superior product quality, responsiveness to requests and necessary actions, commercial commitments, support of program development, and its pivotal role and growth potential as a key global raw material supply chain partner to Hitachi Astemo. Envalior’s contributions include supporting the production of air intake manifolds supplied to Honda, further solidifying its reputation for excellence in the automotive industry.

“Congratulations to our incredible team for their hard work and unwavering commitment to excellence, which made this remarkable achievement possible,” said Grace Showalter, Regional Commercial Director for the Americas. “A special acknowledgment goes to Eric Sheppard, Global Key Account Manager, Dr. Davide Preti, Automotive Sales Director, and Lisa Noyes, Customer Service Representative, whose exceptional leadership and contributions were instrumental in earning this award. Together, this team has set a new benchmark for quality and service in our industry.”

Hitachi Astemo, a global leader in advanced mobility solutions, specializes in automotive components, transportation technologies, and industrial systems. As a top-tier supplier to the automotive and motorcycle industries, Hitachi Astemo’s recognition of Envalior underscores the strength of their ongoing collaboration. In 2023, the Envalior North America team supplied Akulon PA6 material, establishing Envalior as the largest supplier of nylon compounds to Hitachi Astemo in North America. Other distributed compounds include Stanyl PA46, Pocan PBT, EcoPaXX PA410, and beginning in 2025, Arnitel TPC.

This recognition reflects Envalior’s unwavering commitment to deliver innovative, high-performance solutions to its partners and to advance excellence in the global mobility sector.

www.envalior.com.

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Record-Breaking 21st Edition of Automechanika Dubai Opens Today With a 15% Increase in Exhibiting Companies

Record-Breaking 21st Edition of Automechanika Dubai Opens Today With a 15% Increase in Exhibiting Companies

Automechanika Dubai 2024 was officially opened by H.E. Mattar Al Tayer, Commissioner General for Infrastructure, Urban Planning and Well-Being Pillar and Director General, Chairman of the Board of Executive Directors of the Roads and Transport Authority (RTA) Dubai

The event features 2,228 exhibitors, an increase of 15% compared to the previous year, and an 18% year-on-year increase in floor space to facilitate demand during the three-day showcase

Automechanika is the largest international automotive aftermarket trade exhibition in the wider Middle East

Dubai, UAE: Automechanika Dubai, the largest automotive aftermarket trade exhibition in the wider Middle East, was officially opened by H.E. Mattar Al Tayer, Commissioner General for Infrastructure, Urban Planning and Well-Being Pillar and Director General, Chairman of the Board of Executive Directors of the Roads and Transport Authority (RTA) Dubai and takes place at the Dubai World Trade Centre (DWTC) from 10-12 December.

Celebrating the 21st edition of the showcase, Automechanika Dubai welcomes 62 participating countries and features 21 international pavilions, highlighting its position as a central trading link for connecting markets from the wider Middle East, Africa, Asia and key CIS countries.

This year’s edition will be the largest to date, with a record 2,228 exhibitors – a 15% increase year-on-year – and over 83,000 square metres of exhibition space, an 18% increase on the 2023 edition, spanning an impressive 17 halls. The event showcases the latest trends and innovations driving the regional and international automotive

aftermarket industry forward.

Several first-time UAE exhibitors will be participating this year, among them are Autohub Conexus, Nissens, and Polarix, while returning exhibitors include AMAP, Central Motors and HAPCO Group. Saudi Arabia also has strong presence with companies such as Middle East Battery Company Minerets Tech, and Tadawol Trading Company,

amongst others.

Elsewhere on the opening day, Khaled Al Awadhi, Director – Transportation Systems Department Roads and Transport Authority highlighted Collaboration as key in accelerating future mobility as part of the Innovation4Mobility main feature. This dedicated space spotlights alternative fuel vehicles, advanced driving technologies, digitalisation, connectivity, and smart infrastructure.

Other highlights from the opening day of the Innovation4Mobility feature included thought-provoking sessions from industry leaders addressing key aspects of mobility transformation. Maxwell Stanley, a Behavioural Change Expert from the UAE Department of Energy, explored how behavioural science can foster sustainable mobility practices. Heiko Seitz, Global eMobility Leader & Partner at PwC, provided a global perspective on electrification trends, highlighting innovations shaping the industry’s future, and renowned mobility expert Dr. Maya Ben Dror presented a session titled ‘Promoting a Greener, Cleaner Community’, focusing on actionable strategies to create sustainableurban environments.

Additionally, the Automechanika Academy launched today under the theme “Collaboration and Innovation in the Automotive Industry’, with regional and international speakers from organisations including the Ministry of Energy & Infrastructure, SGS Gulf Limited, ZF Services Middle East LLC, and OWS Automotive Solutions discussing regulatory compliance, trends in automotive technology, circular economy in automotive production and the automotive aftermarket in KSA, among other topics.

Meanwhile, the Lubricants & Base Oils Conference also debuted today, adding a deep dive into the evolving lubricants landscape. Sessions included Mohammad El Sadek, Director of Lubricants at ENOC from ENOC delivering a keynote on shaping the future of lubricants, Haytham Yehia, General Manager – Middle East and Central Asia at Shell Lubricants Middle East, examining sustainability in the lubricants market and Vrinda S. Nair, Regional Manager – Certification from SGS Gulf Limited examining regulatory changes impacting lubricant technology.

Mahmut Gazi Bilikozen, Portfolio Director, Mobility & Logistics at Messe Frankfurt Middle East, said: “Automechanika Dubai 2024 is a testament to the incredible growth of the automotive aftermarket industry. With a record-breaking number of exhibitors, expanded exhibition space, and an array of insightful conferences and features, the event has solidified its reputation as the region’s most important platform for networking and knowledge-sharing. We are proud to offer a space where industry professionals can explore new opportunities, build meaningful connections, and drive innovation in this fast-evolving sector.”

Other returning highlights include an exploration of opportunities in Africa through AfriConnections and the Modern Workshop, showcasing cutting-edge technology, tools, and solutions in the automotive repair and maintenance industry.

Exciting new additions this year include the PowerTread Workshop, focusing on innovations in tyres and batteries, and the Future Fleet & Telematics Workshop, featuring pioneers discussing the latest trends in telematics. Meanwhile, the new Southeast Asia Regional Focus will spotlight the region’s contribution to the UAE’s automotive aftermarket growth.

www.messefrankfurt.com

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Swop 2024 Concludes With Success, Paving The Way For Future Innovation In The Packaging Industry

Swop 2024 Concludes With Success, Paving The Way For Future Innovation In The Packaging Industry

Shanghai World of Packaging (swop) came to a successful close on November 20, 2024 in Shanghai, China, marking a remarkable conclusion to the annual grand show for the packaging industry in Asia. This year’s event stood out as a premier annual exhibition, highlighting a fresh vision and a deep alignment with the dynamic needs of the market. With a focus on globalization, swop has firmly established itself as an essential platform for exhibition, communication, and collaboration across the entire packaging value chain.

Covering more than 65,000 square meters, swop 2024 attracted 903 distinguished companies from across the globe, including those from China, Germany, Spain, Finland, the United States, and many other countries and regions. The event drew 33,192 trade visitors from around the world, offering a vibrant space for exhibitors and buyers to engage in fruitful discussions and explore opportunities for collaboration in response to the evolving landscape of global supply chains.

Ms. Evian Gu, General Manager of Messe Düsseldorf (Shanghai) Co., Ltd., said: “As an essential bridge connecting production and consumption, the demand for the packaging industry continues to grow.This surge not only highlights the vitality of global trade but also reflects the ongoing drive across industries to innovate and elevate the quality of product packaging. As a member of the interpack alliance, swop benefits from extensive support that boosts its international reach and influence. ”

Ms. Rita Chu, Vice Chairman of The Adsale Group, said, swop has always been a bellwether for industry hotspots and trends, and this year is no exception, delivering an impressive array of highlights. “Sustainability” can be said to be a consensus within the global packaging industry, while “going overseas” represents a new blue ocean for numerous enterprises to expand into. This year, swop participants from all walks of life can not only gain insights into the latest dynamics and technological trends in the packaging industry but also find ideal solutions tailored to their own development needs.

Highlights of swop 2024: Showcasing Cutting-Edge Packaging Industry Technologies and Development Trends

– Spotlight on digitalization, intelligence, and automation in packaging equipment and new technologies

In response to the growing demands of the packaging market, swop 2024 featured a range of innovative solutions for trade buyers and visitors, covering product production, transportation, and supply chain traceability. On-site demonstrations included advanced digital factory models and comprehensive strategies designed to enhance competitiveness, with a particular focus on product traceability and food safety. Leading companies such as Youngsun, Hualian, Wuhan Renpak, Zhongya, Eiahe, Brother, GURKI, SDW, Soontrue, RESURE, Acepack, WANERX, Warsonco, FULLTECH, Songben, Litai, BOHUI, Haomingda, Ruiji Jinhong, Jerry, JOSO, Vixdetect, Techik, and BHI presented their star products and breakthrough technologies, making significant contributions to driving progress within the packaging industry.

– Focus on packaging containers and tableware production lines, showcasing innovative technologies and eco-friendly materials

This year’s swop brought together an impressive lineup of renowned exhibitors, including Haitian, Chen Hsong, FCS, Lisong, Jwell, Liuzhou Jingye, Huayan, ONGO, Yuto, Malex, Fangbang, HOME-LINK, Huawei, Royal New Materials, ZHONGKE PRECISION MACHINERY, MAIWEI, LITAI, RuiDa, DISCOVER, Mingguo, SINI MACHINERY, Chengda, and SABIC. Featured exhibits included flexible case opening, sealing, and palletizing integrated machines, fully automatic one-stage plastic injection blow molding machines, intelligent multi-component food packaging solutions, fully automatic intelligent production lines, and other innovative solutions focused on automation, environmental sustainability, and functionality.

– Leading the green revolution in packaging: Showcasing innovative eco-friendly materials

As environmental compliance and green packaging continue to take center stage, swop 2024 embraced this transformative trend by focusing on the green revolution in raw packaging materials. The event attracted a wide range of innovative material suppliers, providing a premier platform for showcasing cutting-edge materials to the exhibitors.  swop 2024 highlighted advanced packaging materials, including MDO-PE and EVOH, demonstrating their applications in sectors such as food and daily chemicals. These materials stood out for their eco-friendly, sustainable, and high-performance qualities. Additionally, bio-based and biodegradable materials were prominently featured, offering innovative solutions for food packaging and driving the industry toward a greener future.

– FMCG Packaging Pavilion at swop 2024: Empowering brands to shine

The FMCG Packaging Pavilion placed consumer needs at the forefront, emphasizing key factors such as user experience, visual appeal, and sustainability. The pavilion showcased popular FMCG products that not only provide effective product protection but also elevate brand value and foster consumer engagement, breathing new vitality into the brands. The pavilion also highlighted “E-commerce Express and Logistics Packaging”, presenting innovative, eco-conscious packaging solutions designed for both convenience and sustainability. Highlights included luxury gift boxes, packaging products for chemicals used in daily life, high-temperature sterilization aluminum foil boxes, fully biodegradable courier packaging bags, and customized packaging for food, beverages, pharmaceuticals, chemicals used in daily life, and e-commerce.

Mr. Thomas Dohse, Director interpack of Messe Düsseldorf, Messe Düsseldorf GmbH, noted that Shanghai, as a crucial business hub for China and Asia, serves as an exceptional platform for showcasing innovations in the packaging industry. The processing and packaging industry is evolving rapidly, driven by an ongoing pursuit of innovation and excellence. swop 2024 provided an ideal platform for visitors to explore the latest industry trends and gain insights into the key factors driving its development.

A Series of Concurrent Events Creates a Premier Platform for Industry Exchange

In its pursuit of establishing a world-class communication platform and reinforcing its role as an industry trendsetter, swop 2024 hosted a diverse range of expert-led forums and technology exchange sessions. These events brought together industry leaders, scholars, and corporate representatives to deliver comprehensive insights into the latest trends in packaging. Key highlights included: E-commerce Packaging green results display and Packaging digital intelligence development trend seminar, Industry-University-Research Cooperation Conference on Packaging Industry and Training Course for Green Packaging Engineers, Raw Materials Innovations, Collaborations on Green Packaging —— Advanced Plastic Packaging Materials Release Conference, Save Food Forum and Awarding Ceremony for Save Food Design Award & Sustainability Design Award China, Customer Acquisition: A Forum on New Opportunities for Cross-border E-commerce Development in the B-end Market, Machine for Food Production & Smart Manufacturing (Shanghai) Forum, Sustainable Future, a journey through the life cycle of sustainable packaging, Overseas Business Matching Meeting, and other engaging activities.

This year, swop collaborated for the fourth time with the Food and Agriculture Organization of United Nations Representation in China to host the Save Food Forum. Reducing food loss and waste is a critical global issue, and packaging plays a vital role in minimizing these losses across the stages of food production, storage, transportation, processing, and consumption. During the forum, experts shared insights and engaged in discussions on three key topics: Packaging Industry for Reducing Food Loss and Waste, Impacts of Climate Change and Consumption Habits on Urban Agri-food Systems, and Women in Packaging.

Ms. Han Yan, Assistant FAO Representative, Food and Agriculture Organization of the United Nations Representation in China, noted that reducing food loss and waste is an important issue faced by all parties today, while packaging plays an important role in reducing food loss and waste in food production, storage, transportation, processing, and consumption. She also emphasized the importance of collaboration and innovation in addressing food loss and waste. Over the years, FAO has worked closely with government agencies, international organizations, the food packaging industry, and private-sector partners to pool ideas and tackle this challenge, with the goal of contributing to global food conservation efforts.

swop 2024 Introduces Customized Visiting Routes to Optimize Buyer-Exhibitor Connections

To enhance the efficiency of buyers’ visits and foster seamless collaboration between exhibitors and buyers, swop 2024 introduced an innovative “Buyer’s Perspective” visiting and procurement model. Throughout the exhibition, swop provided attendees with a detailed packaging route navigation map and introduced three thoughtfully curated thematic routes, comprising 12 specific visiting pathways. These thematic routes were designed to address the core needs of trade buyers, targeting key packaging challenges such as product traceability, operational efficiency, accuracy, and yield improvement. By offering precise matching, swop enabled industry buyers to discover tailored solutions, including Intelligent Packaging Solutions for Industry Pain Points, Container Production Routes, and Specialty Packaging Material Routes. This initiative ensured that buyers could efficiently explore packaging solutions aligned with their needs throughout the three-day event.

 

Positive Response and Widespread Praise for the Exhibition

swop 2024 provided a comprehensive platform for collaboration and exchange between exhibitors and trade buyers, receiving strong support from nearly 60 industry associations spanning sectors such as food, daily chemicals, e-commerce, plastics, printing, and packaging, both domestically and internationally. The event attracted over 300 visitor groups from China, along with participants from various countries and regions from across Asia, particularly Southeast Asia.

Exhibitor Testimonials

Ms. Jiang Jing, the Marketing Director of Hualian Machinery Group commented, “The packaging industry is increasingly focusing on efficiency, intelligence, and personalized customization. At swop, we showcased our cutting-edge packaging solutions and connected with numerous buyers with relevant needs. We look forward to returning next year!”

Mr. Lai Jisheng, the Sales Manager from Guangdong Yuedong Machinery Industry Co., Ltd. expressed, “By participating in swop 2024, we have conducted in-depth exchanges with numerous professional buyers and visitors from all around the world, gaining abundant insights. We are extremely satisfied with the high quality and professionalism of swop.”

Visitor Testimonials

Mr. Udomsuk Limwongthong, the Managing Director of The One Point from Thailand, attending as a visitor, stated: “This year’s exhibition was impressive in scale, with numerous exhibiting companies. I came to discover innovative technologies and trends in the packaging industry, and I gained a wealth of knowledge. I’ll definitely attend the next swop and look forward to seeing even more groundbreaking innovations.”

Ms. Virginia Marte, the COO of CAFÉCUATROPH COFFEE STORE, a food manufacturer from the Philippines and a member of Alipop, shared, “I attended swop to find packaging machines and materials. It was my first time at such a large-scale exhibition, and I was pleased to find a wide range of suppliers offering excellent value for money. I’ll be back next year.”

swop 2025 will be held from November 25 to 27, 2025, at SNIEC (Shanghai New International Expo Centre) in Shanghai, China. We are confident that the shift to an annual event will create even greater opportunities for exhibitors, trade buyers, and the packaging industry as a whole. We look forward to welcoming you once again to swop, the premier global platform for the packaging industry, where you can discover cutting-edge concepts and technologies, exchange insights on packaging trends and opportunities, and collaborate in shaping a brighter future for the industry.

www.swop-online.com

www.messe-duesseldorf.de

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USIBC Signs MOU with Government of Telangana, Hosts AI and GCC Industry Roundtable

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USIBC Signs MOU with Government of Telangana, Hosts AI and GCC Industry Roundtable

The U.S. Chamber of Commerce’ s U.S. India Business Council Global Private Limited (USIBC GPL) and the Department of Information Technology, Electronics & Communications (IT E&C), Government of Telangana, signed a Memorandum of Understanding (MOU) to bolster U.S.-India collaboration and partnership in technological innovation.

The MOU was signed in the presence of Chief Guest, Honourable Minister for Information Technology (IT), Electronics & Communications (E&C), Industries & Commerce (I&C), and Legislative Affairs, Shri D Sridhar Babu and Special Chief Secretary to the Government of Telangana for IT E&C and I&C, Shrit Jayesh Ranjan, Guest of Honour, Ms. Jennifer Larson, U.S. Consul General Hyderabad, and USIBC Managing Director Rahul Sharma.

The MoU outlines cooperation in key focus sectors including IT, Artificial Intelligence (AI), electronics and Global Capability Centers (GCCs). The signing was followed by an industry roundtable on AI and GCCs, reinforcing Hyderabad and Telangana’s role as a global technology hub.

Honourable Minister Shri D. Sridhar Babu noted, “Telangana has emerged as a global leader in innovation, and this MoU marks a new chapter in deepening our partnership with the United States. Our collaboration with USIBC is focused on driving investment, fostering innovation, and generating employment opportunities, paving the way for a future powered by cutting-edge technologies such as AI and GCCs.”

Guest of Honour Ms. Jennifer Larson remarked, “The United States and India share a vision of leveraging technology to solve global challenges. This MoU is a testament to the strong collaboration between Telangana and U.S. businesses, showcasing how regional partnerships can drive innovation, economic growth, and mutual prosperity.”

Special Chief Secretary to the Government of Telangana for IT E&C and I&C, Shri Jayesh Ranjan said, “Hyderabad’s thriving technology ecosystem, supported by a robust talent pool and progressive policies, is a testament to the state’s commitment to innovation. This partnership with USIBC will further position Telangana as a leading destination for global investments in emerging technologies.”

The discussion highlighted Hyderabad’s thriving ecosystem of skilled professionals and its pivotal role in U.S.-India collaborations. The participants explored AI-driven opportunities across sectors as well as the ways to optimally harness AI technological innovation for global good while at the same time prevent misuse via regulation, governance, ethical use, in a manner that does not stifle innovation.

Rahul Sharma, Managing Director of USIBC, stated, “This MoU represents a pivotal moment in strengthening the technological and economic ties between the United States and Telangana. By leveraging the state’s dynamic ecosystem and the expertise of U.S. industry, we are unlocking new opportunities in AI and GCCs that will define the next phase of global innovation. USIBC is proud to support this partnership, which underscores our dedication to advancing transformative initiatives and creating pathways for sustainable growth and shared success.”

USIBC is thrilled to deepen technological ties between U.S. and Indian regional governments and pursue activities with industry under U.S.– India initiative on critical and emerging technologies (iCET). Launched at the U.S. Chamber of Commerce in January 2023, USIBC has worked closely with governments and industry in pursuing activities across iCET sectors including AI, semiconductors and electronics, advanced telecommunications, space tech, among other areas.

https://www.uschamber.com

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SPE NAMES DONALD (DON) HYLTON THERMOFORMER OF THE YEAR

SPE NAMES DONALD (DON) HYLTON THERMOFORMER OF THE YEAR

The Society of Plastics Engineers (SPE) Thermoforming Division has named Donald (Don) Hylton Thermoformer of the Year.

The award will be presented during SPE’s Thermoforming Awards Dinner, held in conjunction with the 30 th  SPE Thermoforming Conference.  The conference will take place May 19-21, 2025 in Atlanta, GA, at Cobb Galleria Centre and the Renaissance Atlanta Waverly Hotel. The Awards Dinner will be held on Tuesday, May 20, at the Hotel.

Don received his BS in chemistry and biology from Kentucky State University and pursued graduate studies in physical chemistry at the University of Louisville. Don began his career in GE’s Plastics Application Center. He was tasked with developing test procedures on a new commercial instrument called a Rheometrics Mechanical Spectrometer (now part of TA Instruments). Don developed the first dynamic mechanical thermal analysis (DMTA) test on this instrument which is now a standard ASTM test method: D7028.

GE developed a program to replace metal refrigerator liners with a thermoformed plastic liner. The new inflation instrument Don developed showed the differences in the materials, reducing the need to conduct expensive and time-consuming trials. The test proved useful in other thermoforming applications and blow molding. GE’s trade secret was eventually published in the Journal of Polymer Engineering and Science in 1980 and was later revered by Chemical Week magazine as the most significant contribution of the year.

In 1980, Don joined ExxonMobil’s Polymers Division and received two assignments: 1) to determine the cause of premature failure of a fiber-grade polypropylene. 2) to develop a thermoformable grade of polypropylene. Polypropylene was not used in thermoforming at the time.

Don’s experience with GE’s ABS liner program became useful for this effort. Don quantified the viscoelastic properties a material needed to be successfully and consistently thermoformed.

The task was to create these same properties with PP. The product became known as “High Melt Strength (HMS PP), a term used today to describe thermoformable PP. Several commercial trials were conducted with the new melt phase forming PP. This was the first time PP was thermoformed on conventional vacuum forming equipment.

Don was also a pioneer in the development of co-extruded multilayer food packaging in collaboration with Campbell Soup, Hormel, and Ball Plastics. These were the first thermoformed shelf-stable plastic food packages commonly seen today. He also worked with Millikin Company to develop the first clear PP for food packaging. Today it is known as clarified PP.

Don attended one of Bill McConnell’s thermoforming workshops and met Stan Rosen, Charlie Hovesapien, Jim Throne, John Griep, and numerous other thermoforming pioneers. They encouraged Don to join the SPE Thermoforming Division and become a member of its board of directors. Bill soon invited Don to present at his next workshop- an invitation that led to Don’s employment with McConnell Company to this day.

In 1995, Don joined Clark Atlanta University as Associate Director of the New Science and Technology Center where he conducted research and pursued new ways of characterizing materials for thermoforming. He also mentored students and influenced their decisions to pursue careers in plastics. Over the years, Don has advised more than 20 PhD chemistry and chemical engineering students at Clark Atlanta, University of Louisville, and Georgia Tech.

At Clark Atlanta, Don developed a new technology and testing equipment for evaluating materials for thermoformability called the Thermoforming Index. Don was able to isolate critical material properties that give a material its “melt strength.” This technology has been used to solve many material-related problems in thermoforming production and is used as a quality control tool.

A member of the Society of Plastics Engineers since 1985, Don was named an Emeritus Member in 2018, and in 1997, one of just three thermoforming Fellows of the Society. An active SPE Thermoforming Division Board Member, Don served as the Division’s ANTEC Technical Program Chair from 2000-2010 and was the first chair of the Division’s Student Affairs Scholarship Program. Don was presented with the Division’s Outstanding Achievement Award in 2000 and its Lifetime Achievement Award in 2014 when he was also named an Emeritus Member of the Division. Don also served as ASTM Plastics Sheeting and Films Subcommittee Chair and reviewed and updated all ASTM standards and test methods for sheeting and films. Don received the ASTM Outstanding Achievement Award for his work in sheeting and films. He is the author of numerous technical papers and the book, Understanding Plastics Testing.

“Each of Don Hylton’s achievements is more impressive than the last,” said Paul Uphaus, SPE Thermoforming Division Chair.  “The SPE Thermoforming Division Board is honored to name Don Hylton as the 2025 SPE Thermoformer of the Year.”

https://thermoformingdivision.com

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XSYS Launches Nyloflex XSN For Superior Performance And Flexibility In narrow Web Printing

XSYS Launches Nyloflex XSN For Superior Performance And Flexibility In narrow Web Printing

  • Ideal for narrow web applications using UV, water-based, and solvent-based inks
  • Inherent flat-top dot plate compatible with both thermal and solvent processing
  • Enhanced formulation with CleanRelease Technology for reduced downtime and plate cleaning

XSYS is proud to announce the launch of nyloflex  XSN, the newest innovation in flexographic plates designed for narrow web printing. This plate combines unparalleled performance with maximum flexibility, catering to the diverse needs of narrow web printers who require efficiency and versatility without compromising on quality.

“With the nyloflex  XSN, we’ve introduced a plate that empowers narrow web printers to meet rapidly changing market demands with confidence,” said Florian Hoelzle, Product Manager for nyloflex  plates at XSYS. “It’s unique flat-top dot structure and new CleanRelease Technology ensure cleaner plates, longer print runs, and minimal press downtime, making it a game-changer in the narrow web segment.”

Key Features and Benefits

Performance & Flexibility for Narrow Web

The nyloflex  XSN is a flat-top dot plate compatible with both thermal and solvent processing methods, providing printers with unmatched versatility. This dual compatibility allows seamless adaptation to evolving customer demands without the need for additional equipment or process changes.

Clean Release Technology for Clean and Consistent Print jobs

Featuring the new CleanRelease Technology, the plate’s formulation prevents ink buildup on the plate surface. This innovation reduces the need for frequent cleanings and press stops, significantly improving Overall Equipment Efficiency (OEE).

Outstanding Compatibility with Various Ink types

The nyloflex  XSN is designed to perform exceptionally well with UV inks, as well as water-based and solvent-based inks. This compatibility ensures outstanding print quality across paper and film substrates.

Plug-and-Play with Existing Equipment

Engineered as an inherent flat-top dot plate, the nyloflex  XSN eliminates the need for additional exposure units or consumables. Printers can achieve superior results right out of the box, simplifying production workflows and reducing costs.

Fast Turnaround for High-Pressure Environments

Thanks to its compatibility with both thermal and solvent processing, the nyloflex XSN offers unparalleled flexibility for integrated printers needing quick design changes and efficient plate turnaround times.

Enabling Printers to be Brilliant

“At XSYS, our goal is to help customers achieve brilliance through innovative solutions that simplify production and enhance productivity,” said Florian. “The nyloflex  XSN embodies this vision by combining cutting-edge technology with practical usability, setting a new standard for narrow web printing.”

www.xsysglobal.com

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